SISTRADE AT PACKAGING INNOVATIONS 2010 FAIR

SISTRADE, a engineering and consultancy company in Information Systems for the vertically market such as printing and packaging industry, will be present with Sistrade® Print in PACKAGING INNOVATIONS FAIR – an important annual fair of the packaging industry – will take place in Warsaw, Poland, in 13 and 14 April.

This fair brings together several professionals in the packaging sectors that are looking for innovative methods and high-impact solutions to present their products. PACKAGING INNOVATIONS FAIR offers the opportunity to promote the Sistrade® Print to professionals in the packaging sector.

Given its importance and strategic positioning, allowing access to Poland markets, "this is a very important fair for SISTRADE by being vertically integrated to industrial companies in Printing & Packaging”.

Visit SISTRADE in the stand C11.